EVSF100-65

CR Technology

Product No:

EVSF100-65

Manufacturer:

CR Technology

Package:

-

Batch:

-

Datasheet:

Description:

Thermal Pad (EverTherm)

Quantity:

In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

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Product Information

Parameter Info
Mfr CR Technology
Type Gap Filler Pad, Sheet
Color White
Shape -
Usage Multi
Series EVSF
Outline 200.00mm x 300.00mm
Package Sheet
Adhesive -
Material -
Thickness 0.1181" (3.000mm)
Shelf Life -
Product Status Active
Backing, Carrier -
Digi-Key Storage -
Shelf Life Start -
Thermal Resistivity 0.9°C/W
Thermal Conductivity 1.5W/m-K
Storage/Refrigeration Temperature -