S1C17W22D101100

Epson Electronics America Inc-Semiconductor Div

Product No:

S1C17W22D101100

Package:

Die

Batch:

-

Datasheet:

Description:

IC MCU 16BIT 64KB FLASH DIE

Quantity:

In Stock : Please Inquiry

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Product Information

Parameter Info
Mfr Epson Electronics America Inc-Semiconductor Div
Speed 4.2MHz
Series -
Package Tray
RAM Size 4K x 8
Core Size 16-Bit
EEPROM Size -
Peripherals LCD, PWM, RFC, WDT
Connectivity I²C, IrDA, SPI, UART/USART
Mounting Type Surface Mount
Number of I/O 41
Core Processor S1C17
Package / Case Die
Product Status Active
Data Converters -
Oscillator Type Internal
Base Product Number S1C17W22
Program Memory Size 64KB (64K x 8)
Program Memory Type FLASH
DigiKey Programmable Not Verified
Operating Temperature -40°C ~ 85°C (TA)
Supplier Device Package Die
Voltage - Supply (Vcc/Vdd) 1.2V ~ 3.6V