HSS23-B20-NP

CUI Devices

Product No:

HSS23-B20-NP

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Description:

HEAT SINK, STAMPING, TO-218/TO-2

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In Stock : 2588

Minimum: 1 Multiples: 1

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Parameter Info

Mfr	CUI Devices
Type	Top Mount
Shape	Rectangular, Fins
Width	1.496" (38.00mm)
Length	1.654" (42.00mm)
Series	HSS
Package	Box
Diameter	-
Material	Aluminum Alloy
Fin Height	0.787" (20.00mm)
Package Cooled	TO-218, TO-220
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Bolt On
Thermal Resistance @ Natural	10.19°C/W
Power Dissipation @ Temperature Rise	7.36W @ 75°C
Thermal Resistance @ Forced Air Flow	5.00°C/W @ 200 LFM