TSX713

EDSYN INCORPORATED

Product No:

TSX713

Manufacturer:

EDSYN INCORPORATED

Package:

-

Batch:

-

Datasheet:

-

Description:

REFLOW VACUUM TIP, HOLE DIA: 1.3

Quantity:

In Stock : 5

Minimum: 1 Multiples: 1

Qty

Unit Price

  • 1

    26.1725

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Product Information

Parameter Info
Mfr EDSYN INCORPORATED
Width -
Height -
Length 0.551" (14.00mm)
Series SOLDAVAC®
Package Bag
Diameter 0.051" (1.30mm)
Tip Type Rework
Tip Shape Nozzle
Tip Chip Size -
Product Status Active
Temperature Range -
For Use With/Related Products -